> You are picking *one* aspect of the many that affectthe cooling parts
> in a box. You also freely jump between the macro and micro effects.
> What is optimal in one is occasionally sub-optimal in the other.
>
> --
> a d y k e s @ p a n i x . c o m
> Harrison for Congress in NY 13CD www.harrison06.com
> Don't blame me. I voted for Gore. A Proud signature since 2001

Finally..... Each layout and case is different. I built this system a year
or so ago and had problems with airflow across the CPU. It was also my first
S775 build. The CPU socket and HS are just slightly different in position
than my previous AMD and Intel boards. This case has a top "chimney" type
fan and it turned out that the turbulence from that fan (exhaust) was
causing a hot spot around the HS/Fan area of the board. By disabling the fan
I fixed the problem. I am sure there is a lot of turbulence in this box, but
also a basic laminar airflow overall. It really doesn't matter. Getting as
much outside (cooler) air to the critical components and getting as much hot
air back out is the goal. HS's by nature cause turbulence when cooling the
CPU, but as far as the case itself, it may take a bit of tweaking here and
there to get the best results, laminar airflow and/or turbulent airflow.

Ed