On Fri, 6 Oct 2006 10:08:42 -0700, "Timothy Daniels"
<TDaniels@NoSpamDot.com> wrote:

>"Ed Medlin" wrote:
>> Each layout and case is different....
>> [......]
>> Getting as much outside (cooler) air to the critical components
>> and getting as much hot air back out is the goal. HS's by nature
>> cause turbulence when cooling the CPU, but as far as the case
>> itself, it may take a bit of tweaking here and there to get the best
>> results, laminar airflow and/or turbulent airflow.
>
>
> Absolutely correct.

Until you start trying to spew nonsense to twist it towards
your agenda.

> Cool air that contacts the components per
> unit time is what is important.

Yes, as I've said all along.

> Whether the turbulence that
> promotes that is caused by design or by accident is not
> important to the heated parts.


This is where you are wrong. You cannot resolve the fact
that "by design" necessarily means a reduction in flow rate.

The goal is to maximize flow rate to the part, and away from
the part. The turbulence that is by design or accident is
only useful when occuring ON the surface of the part being
cooled.

This is shown in all cooling systems. A perforated grill
over anything hot would help if your theory were true, but
it does not.

Once again you try to fixate on only one variable and argue
away all the others, when it was already known the others
had as much effect and an entire industry designs around
their experience, not your random speculations.